Intel says it will rely on a new technology called Embedded Multi-Die Interconnect Bridge (EMIB), which it says can reduce the average silicon footprint to "less than half that of standard discrete components on a motherboard" by combining the CPU and discrete graphics into a single processor package.

In this case, Intel says it will opt for combining one of its eighth-generation Core H-series processors with a semi-custom graphics chip from AMD.

There's no word on an exact release date, but Intel says it expects manufacturers to begin shipping systems based on the new chip at some point in the first quarter of 2018.

https://www.windowscentral.com/intel-and-amd-team-package-radeon-graphics-core-cpu

https://newsroom.intel.com/editorials/new-intel-core-processor-combine-high-performance-cpu-discrete-graphics-sleek-thin-devices/




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[開箱文]MSI GE63VR 7RF

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